![[ICO]](/icons/blank.gif) | Name | Last modified | Size | Description |
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![[PARENTDIR]](/icons/back.gif) | Parent Directory | | - | |
![[DIR]](/icons/folder.gif) | 32nm/ | 2014-01-07 04:16 | - | |
![[ ]](/icons/compressed.gif) | sand-to-silicon_video_WMV.zip | 2009-11-05 19:00 | 3.3M | |
![[ ]](/icons/compressed.gif) | sand-to-silicon_video_MOV.zip | 2009-11-04 19:00 | 28M | |
![[VID]](/icons/movie.gif) | sand-to-silicon_video.flv | 2009-11-04 19:00 | 6.7M | |
![[ ]](/icons/compressed.gif) | Sand-to-Silicon_photos.zip | 2009-07-28 20:00 | 41M | |
![[ ]](/icons/layout.gif) | Making_of_a_Chip.pdf | 2009-07-09 20:00 | 375K | |
![[IMG]](/icons/image2.gif) | 38_10_testing-complete cpu_comp.jpg | 2009-03-18 20:00 | 6.0M | |
![[IMG]](/icons/image2.gif) | 37_10_testing-complete cpu_3.jpg | 2009-03-18 20:00 | 3.2M | |
![[IMG]](/icons/image2.gif) | 36_10_testing-complete cpu_2.jpg | 2009-03-18 20:00 | 3.9M | |
![[IMG]](/icons/image2.gif) | 35_10_testing-complete cpu_1.jpg | 2009-03-18 20:00 | 3.4M | |
![[IMG]](/icons/image2.gif) | 34_09_die-packaging_comp.jpg | 2009-03-18 20:00 | 6.2M | |
![[IMG]](/icons/image2.gif) | 33_09_die-packaging_3.jpg | 2009-03-18 20:00 | 3.6M | |
![[IMG]](/icons/image2.gif) | 32_09_die-packaging_2.jpg | 2009-03-18 20:00 | 3.8M | |
![[IMG]](/icons/image2.gif) | 31_09_die-packaging_1.jpg | 2009-03-18 20:00 | 4.1M | |
![[IMG]](/icons/image2.gif) | 30_08_wafer-test-cut_comp.jpg | 2009-03-18 20:00 | 6.5M | |
![[IMG]](/icons/image2.gif) | 29_08_wafer-test-cut_3.jpg | 2009-03-18 20:00 | 3.8M | |
![[IMG]](/icons/image2.gif) | 28_08_wafer-test-cut_2.jpg | 2009-03-18 20:00 | 3.6M | |
![[IMG]](/icons/image2.gif) | 27_08_wafer-test-cut_1.jpg | 2009-03-18 20:00 | 4.0M | |
![[IMG]](/icons/image2.gif) | 26_07_interconnections_comp.jpg | 2009-03-18 20:00 | 5.7M | |
![[IMG]](/icons/image2.gif) | 25_07_interconnections_2.jpg | 2009-03-18 20:00 | 4.3M | |
![[IMG]](/icons/image2.gif) | 24_07_interconnections_1.jpg | 2009-03-18 20:00 | 3.5M | |
![[IMG]](/icons/image2.gif) | 23_06_metal-deposition_comp.jpg | 2009-03-18 20:00 | 5.6M | |
![[IMG]](/icons/image2.gif) | 22_06_metal-deposition_3.jpg | 2009-03-18 20:00 | 3.6M | |
![[IMG]](/icons/image2.gif) | 21_06_metal-deposition_2.jpg | 2009-03-18 20:00 | 3.9M | |
![[IMG]](/icons/image2.gif) | 20_06_metal-deposition_1.jpg | 2009-03-18 20:00 | 3.5M | |
![[IMG]](/icons/image2.gif) | 19_05_ion-implantation_comp.jpg | 2009-03-18 20:00 | 6.5M | |
![[IMG]](/icons/image2.gif) | 18_05_ion-implantation_3.jpg | 2009-03-18 20:00 | 3.4M | |
![[IMG]](/icons/image2.gif) | 17_05_ion-implantation_2.jpg | 2009-03-18 20:00 | 3.8M | |
![[IMG]](/icons/image2.gif) | 16_05_ion-implantation_1.jpg | 2009-03-18 20:00 | 3.5M | |
![[IMG]](/icons/image2.gif) | 15_04_etching_comp.jpg | 2009-03-18 20:00 | 5.4M | |
![[IMG]](/icons/image2.gif) | 14_04_etching_3.jpg | 2009-03-18 20:00 | 3.2M | |
![[IMG]](/icons/image2.gif) | 13_04_etching_2.jpg | 2009-03-18 20:00 | 3.4M | |
![[IMG]](/icons/image2.gif) | 12_04_etching_1.jpg | 2009-03-18 20:00 | 3.4M | |
![[IMG]](/icons/image2.gif) | 11_03_patterning_comp.jpg | 2009-03-18 20:00 | 5.1M | |
![[IMG]](/icons/image2.gif) | 10_03_patterning_3.jpg | 2009-03-18 20:00 | 3.4M | |
![[IMG]](/icons/image2.gif) | 09_03_patterning_2.jpg | 2009-03-18 20:00 | 3.2M | |
![[IMG]](/icons/image2.gif) | 08_03_patterning_1.jpg | 2009-03-18 20:00 | 3.6M | |
![[IMG]](/icons/image2.gif) | 07_02_ingot-wafer_comp.jpg | 2009-03-18 20:00 | 4.5M | |
![[IMG]](/icons/image2.gif) | 06_02_ingot-wafer_2.jpg | 2009-03-18 20:00 | 3.2M | |
![[IMG]](/icons/image2.gif) | 05_02_ingot-wafer_1.jpg | 2009-03-18 20:00 | 3.5M | |
![[IMG]](/icons/image2.gif) | 04_01_sand-ingot_comp.jpg | 2009-03-18 20:00 | 6.8M | |
![[IMG]](/icons/image2.gif) | 03_01_sand-ingot_3.jpg | 2009-03-18 20:00 | 3.3M | |
![[IMG]](/icons/image2.gif) | 02_01_sand-ingot_2.jpg | 2009-03-18 20:00 | 3.7M | |
![[IMG]](/icons/image2.gif) | 01_01_sand-ingot_1.jpg | 2009-03-18 20:00 | 5.8M | |
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